With a unique heat-spreader design, Biwin HX100 can decrease the operating temperature by over 5 °Celsius. Equipped with premium ICs and an unlocked PMIC for higher voltage, HX100 is capable of one-click overclocking with data rates of up to 7200 MT/s, supporting XMP 3.0 and AMD EXPO.

The special design of Biwin HX100 for optimized heat dissipation features a high-efficient thermal conductive silicone pad and the highest-grade aluminum heat spreader with parallel cooling fins, forming an armor that combines aesthetics with cooling efficiency. The high-efficient thermal conductive silicone pad is closely attached to the memory ICs, rapidly transferring heat to the heat spreader. All of these features help HX100 decrease the operating temperature by over 5 °Celsius.

Biwin HX100 is built with premium ICs selected automatically, setting a strong foundation for high performance and great overclocking potential.

Biwin HX100 supports overclocking with XMP 3.0 and AMD EXPO to unlock high-speed with one click, and to help you outpace your gaming competitors right from the start.

Biwin HX100 features superior performance across all intensive user scenarios – a winning product for a better gaming experience, impressive overclocking, faster video editing, and smoother 3D modeling.